Model |
ML® 3 Baby |
ML® 3 Baby Plus |
ML® 3 Mesa |
ML® 3 Pro |
ML® 3 Pro XL |
Resolution
|
1 - 5 µm
(1 lens)
|
up to 0.6 - 5 µm
(2 lenses)
|
0.6 - 5 µm
(3 lenses)
|
up to 0.4 - 5 µm
(up to 5 lenses)
|
up to 0.4 - 5 µm
(up to 5 lenses)
|
Write speed [mm2/min] |
50 |
50 - 180 |
17 - 180 |
10 - 180 |
10 - 180 |
Wavelength[nm]
|
405
(and/or 365, 385)
|
405
(and/or 365, 385)
|
405
(and/or 365, 385)
|
385
(and/or 365, 385)
|
385
(and/or 365, 385)
|
Microscope objectives
|
3x to 10x
(1 item from the range)
|
3x to 20x
(2 items from the range)
|
3x to 20x
(3 from the offer)
|
3x to 50x
(up to 5 from the offer)
|
3x to 50x
(up to 5 from the offer)
|
Grayscale lithography |
Yes (255 levels) |
Yes (255 levels) |
yes (255 levels) |
yes (up to 768 levels) |
yes (up to 768 levels) |
XY positioning table resolution [nm] |
15 |
15 |
15 |
4 |
4 |
XY interferometer resolution [nm] |
15 |
15 |
15 |
1 |
1 |
Min. Addressable network [nm] |
100 |
60 |
30 |
30 (option: 12.5) |
30 (option: 12.5) |
Maximum substrate dimensions [mm] |
155 x 155 x 7 |
155 x 155 x 7 |
155 x 155 x 7 |
230 x 230 x 15 |
up to 300 x 300 x 175 |
Writing area [mm] without corner restrictions |
149 x 149 |
149 x 149 |
149 x 149 |
195 x 195 |
295 x 295 |
Optical profilometer |
no |
yes |
yes |
yes |
yes |
Virtual Mask Aligner |
No |
Optional |
Optional |
yes
|
yes
|
Multiple chips option |
no |
Optional |
optional |
yes
|
yes
|
Temperature stabilization |
no |
optional |
optional |
yes |
yes |
Optical table for vibration isolation |
Optional |
Optional |
Optional |
yes |
yes |
Possible upgrade |
yes |
yes |
yes |
(backside alignment) |
(backside alignment) |
Direct maskless optical lithography, or direct laser writing, significantly reduces the time and cost of piece production and prototyping. In addition, automatic resolution selection enables the user to write structures at high speed while maintaining optimal resolution throughout the writing area. Automatic focusing together with the substrate surface inspection tool allows writing even on uneven, angled and curved substrates.
Virtual Mask Aligner (VMA) is a tool for projecting the structure to be written onto the live camera image of the sample. This tool simplifies manipulation during microcontacting, when writing on existing structures and during multi-step writing.
The integrated profilometer offers the possibility to preview the surface profile of the sample and at the same time allows automatic correction of unevenness during writing. The software allows the display of the profile in sections along the x and y axes, or export of the data for further analysis.
Elevation correction during writing (focus lock function) allows writing on uneven (inclined, bulging, etc.) substrates.
Wide Field Viewer allows a wide view of the sample by stitching camera images with optional magnification using the microscope objectives present. This makes it easier to find small elements on large area samples.
Automatic markerrecognition and sample alignment facilitates multiple writes to the photoresist and increases repeatability when writing structures. In addition, the instrument can be extended with a tool for finding markers on the underside of the substrate(backside alignment).
Automatic generation and reading of QR codes is now available for all models in the Microwriter ML3 series.
The illumination wavelength option (365 nm, 385 nm or 405 nm) allows writing to a wide range of photoresists (broadband, g-, h-, i-line positive and negative resists including the popular SU-8). For even more system flexibility, we also offer a dual-wavelength option for any of the systems. That is, the option of using two recording wavelengths (e.g. 365 nm and 405 nm).
Another one of the many extras is a communication module that automatically notifies you when a job is completed, for example, by notification to your email inbox.
The use of a long-life LED power supply (guaranteed for 5 years) keeps operating costs to a minimum.